Mica-AVA (Far East) Industrial Ltd

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1. Thin Core Copper Clad Laminate & Prepreg

Copper Clad Laminate for HDI/ high layer count PCB fabricator
High Tg (> 170 oC)
Phenolic cured (Dicy Free) system with inorganic filler
High Td (decomposition temp. > 340 oC by TGA)
Lead free process compatible (260 oC IR reflow 6x ...

2. Copper Clad Laminate

Tg 170
Excellent thermal performance, T-288, T-300 and high Td
Lead Free process compatible, 6x 260 oC reflow + 6x 288 oC solder float,10 sec no delamination inspected by micro-section
Low cost version
Limited CTE for high through-hole reliabilit ...

3. Thin Core Copper Clad Laminate

Excellent thermal performance, T-288, T-300 and high Td
Lead Free process compatible, 6x 260 oC reflow + 6x 288 oC solder float,10 sec no delamination inspected by micro-section
Low cost version
Limited CTE for high through-hole reliability
Norma ...