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KZT Micro Electronics Technology Co.,Ltd
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電子電工-> 電子零件-> PDA連接器 ( 1 )
電子電工-> 電子零件-> 連接器 ( 2 )
電子電工-> 電子零件-> 插座 ( 1 )
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1.
High Quality eMCP221 Socket to USB, for BGA 221 testing, size 11.5x13mm, nand flash programmer, Clam
Feature:
1. eMCP adapter for BGA221 , compatible with all brand eMCP , for example Sumsung , Toshiba , Hynix , Sandisk , Intel etc ,
2. Easy to operate , simply insert the USB into your PC ,
3. Support flat bottom and solder ball testing ...
2.
eMMC test adapter with SD Interface,Clamshell Structure,for BGA153 11.5_13mm BGA169 test socket,for
Features:
1. Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC and Intel.
2. Apply to BGA153 and BGA169.
3. eMMC size of this product is 11.5x13mm, we also provide other sizes of 12x16mm, 12x18mm and 14x18mm.
4. Apply to eMMC ...
3.
Nand flash pogo pin test socket,eMMC Socket with SD,For BGA169,Apply to eMMC size_11.5x13_0.5 , for
Features:
1. Apply to Samsung,Sandisk,Toshiba,Hynix,Micron,MTK,Intel, etc--eMMC
2. Apply to BGA169.
3. Accurate positioning on flat bottom pad and solder of eMMC.
4. Long operating life,up to 30,000 times.
5. Apply to eMMC thickness:0.8--1.5mm.
...
4.
eMCP221 Socket with SD interface,Nand flash test socket,For BGA 221,Apply to eMCP size_11.5x13_0.5,a
Features:
1.aluminium alloy socket with Pogo Pin.
2. Apply to Samsung,Sandisk,Toshiba,Hynix,Micron,MTK,Intel, etc--eMCP
3. Apply to BGA221.
4. Accurate positioning on flat bottom pad and solder of eMCP.
5. Long operating life,up to 30,000 ...
5.
eMMC eMCP test socket all in one,3in1 socket with USB Interface, for BGA153 BGA169 BGA162 BGA186 BGA
1. Apply to eMCP and eMMC of Sumsung, Sandisk, Toshiba, Hynix, Micron, MTK and Intel.
2. Apply to BGA153 BGA169 BGA162 BGA186 BGA221.(just need to change the coupled socket)
3. Easy operation by just inserting the USB into PC.
4. This ...
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